Kempers, Roger
Department:
- Mechanical Engineering
Main Office:
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Email Address:
roger.kempers@lassonde.yorku.caWebsite:
Research Interests
- Fundamental and Applied Two-Phase Flow & Heat Transfer
- Thermal Energy Transport, Exchange, & Conversion Technology Development
- Advanced Cooling of Electronic Devices & Systems
- High Performance Thermal and Electrical Interface Materials
- Thermal Materials Characterization
- Additive Manufacturing of Composite Materials for Heat Transfer Applications
Bio
Dr. Roger Kempers earned his B.Eng. and M.A.Sc. degrees in Mechanical Engineering at McMaster University and a PhD in Mechanical Engineering at Trinity College Dublin, Ireland.Prior to joining the Lassonde School of Engineering, he was a Distinguished Member of Technical Staff at Nokia (formerly Alcatel-Lucent), where he led the R&D of advanced thermal management technologies for telecommunications hardware. Previously, Dr. Kempers worked as a Research Engineer at Lucent Technologies, Bell Labs Ireland, where his activities ranged from fundamental research to technology development, licensing and product integration.His research interests lie primarily in the area of thermal-fluid sciences and are multi-disciplined in nature, geared towards the advancement of heat transport, exchange and conversion technologies to help address the world’s energy challenges.Dr. Kempers is also a thermofluids & heat transfer consultant and is the founding director of the Advanced Thermofluids & Heat Transfer Research Lab (TF-LAB) at the Lassonde School of Engineering, York University.
Selected Publications
- E.V. Sempels, R. Kempers & F. J. Lesage, (2016) “Load-bearing Figure-of-Merit Characterization of a Thermoelectric Module” IEEE Transactions on Components, Packaging and Manufacturing Technology, 6, pp. 50-57, DOI: 10.1109/TCPMT.2015.2501321
- A.J. Robinson, A.M. Lyons & R. Kempers, (2016) “Modelling the Effective Thermal Conductivity of Compressing Structures Including Contact Resistance” Simulation Modelling Practice and Theory, 67, pp. 74-88, doi:10.1016/j.simpat.2016.06.003
- K. Smith, G. Byrne, R. Kempers, A.J. Robinson (2016) “Electrohydrodynamic Augmentation of a Reflux Thermosyphon,” Experimental Thermal and Fluid Science, 79, pp. 175-186, doi:10.1016/j.expthermflusci.2016.07.003
- K. Smith, A.J. Robinson, R. Kempers, (2016) “The Effects of Bend Angle and Fill Ratio on the Performance of a Naturally Aspirated Thermosyphon,” Applied Thermal Engineering, 101, pp. 455-467, doi:10.1016/j.applthermaleng.2016.01.024
- R. Kempers, A. Lyons & A.J. Robinson, (2013) “Modelling and Experimental Characterization of Metal Micro-Textured Thermal Interface Materials” Journal of Heat Transfer, 136, pp. 011301-1-011301-11 DOI: 10.1115/1.4024737
- R. Kempers, P. Ahern, A.J. Robinson & A. M. Lyons, (2012) “Modeling the Compressive Deformation of Metal Micro-Textured Thermal Interface Materials using SEM Geometry Reconstruction” Computers and Structures, 92-93, pp. 216-228.
- B.P. Whelan, R. Kempers & A.J. Robinson, (2012) “A Liquid-Based System for CPU Cooling Implementing a Jet Array Impingement Waterblock and a Tube Array Remote Heat Exchanger” Applied Thermal Engineering, 39, pp. 86-94.
